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COB-MICA

COB-MICA stands out with its advanced full flip-chip COB process, delivering a sleek, light, and thin profile. Designed with a 16:9 ratio, it ensures a perfect fit for various applications. The front access feature simplifies maintenance, while the enhanced heat dissipation system extends its lifespan. With signal and power redundancy, it ensures uninterrupted and reliable performance, making it an ideal choice for high-demand display scenarios.

COB Technology - Top Packaging Meets Ultra-Precision Vision

Full Flip-chip COB Process

Full Flip-chip COB Process is an advanced semiconductor packaging technology for LED displays, where flip-chip LED chips (with electrical contacts on their surface) are directly bonded to a circuit board using conductive materials, eliminating the need for traditional wire bonding. 

Light & Thin

The cabinet impresses with its feather-light weight of only 4kg and ultra-thin profile measuring only 29.7mm. This design makes it easy to handle during installation and transportation while saving valuable space in any setting. Its reduced weight also lessens load-bearing demands, allowing for installation on various surfaces without extensive reinforcement, streamlining the setup process, and expanding placement possibilities.

16:9 Ratio

Tailored for inherent 16:9 aspect ratios, Mica allows for flexible configuration into diverse sizes, such as widescreen formats, delivering unparalleled adaptability for any scenario that demands 4K or 8K LED display canvases.

Front Access

Front access enables technicians to conduct repairs and troubleshooting directly from the display’s front. This approach eliminates the need for rear access, saving time and effort, especially in space-constrained installations. It minimizes the risk of damaging delicate components during service, safeguarding the display’s performance and extending its lifespan while enhancing cost-effectiveness.

Better Heat Dissipation Longer Lifetime

COB-Mica with advanced heat dissipation efficiently manages heat, preventing overheating and component degradation. This ensures consistent performance, minimizes color shift/brightness decay, and extends operational lifetime, delivering long-term reliability and cost-effectiveness across high-demand applications.

Signal & Power Redundancy

Signal & Power Redundancy ensures non-stop operation via backup pathways for both signals and power. Dual systems automatically switch to reserves if primaries fail, eliminating downtime—a must for critical 24/7 setups like control rooms. This design cuts single-point risks, boosts reliability, and guarantees uninterrupted performance in high-stakes environments.

Download COB-MICA Brochure

Model P0.7 P0.9 P1.25 P1.56
Pixel Pitch 0.78mm 0.9375mm 1.25mm 1.56mm
LED Type Flip-COB(common cathode)
Cabinet Dimension(mm) 600*337.5*29.7
Cabinet Resolution 768*432 640*360 480*270 384*216
Module Size(mm) 150×168.75
Cabinet Weight 4kg
Cabinet Material Die-casting Aluminum
Driving Type 1/36 1/54 or 1/36 1/60 or 1/27 1/48
maintenance Front  service
Brightness 600~1500nits 600~800/1500nits 600~800/1500nits 600~800nits
Max Power 396W/m² 380/363W/m² 300/403W/m² 300W/m²
Avg Power 132W/m² 127/121W/m² 110/134W/m² 110W/m²
IP Rating Front: IP54  Rear: IP30
Refresh Rate >3840Hz
Installation Type Mounting/Hanging/Stacking
Gray Scale 16bit
Viewing Angle H:170°V:170°
Operational Temp -20℃~+50℃
Operational Humidity 10%-90%RH

COB-MICA Key Features

Full Flip-chip COB Process

Light & Thin

16:9 Ratio

Front Access

Better Heat Dissipation Longer Lifetime

Application Fields

● Command and dispatch center

● Visual data center

● High-end commercial display

● Meeting application

● Home video display

● Virtual display